Published paper in Laser & Photonics Reviews on October 2020

Femtosecond laser micromachining allows rapid and cost‐effective fabrication of thermally‐reconfigurable photonic integrated circuits with unique 3D geometries. Here we exploit thermally‐insulating 3D microstructures to decrease the power needed to induce a 2π phase shift down to 37 mW and to reduce the thermal crosstalk to a few percent for an inter‐waveguide separation down to 80 μm.

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